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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12532574 B1

PDFFull Text
Date of Patent:
Jan. 20, 2026

Filed:

Apr. 29, 2022

Method of preparing a device coupon for micro-transfer printing, device wafer including said device coupon, and optoelectronic device manufactured from said device wafer

Applicant:

Rockley Photonics Limited, Altrincham, GB;

Inventors:

Guomin Yu, Glendora, CA (US);

Mohamad Dernaika, Cork, IE;

Ludovic Caro, Cork, IE;

Hua Yang, Cork, IE;

Aaron John Zilkie, Pasadena, CA (US);

Assignee:

Rockley Photonics Limited, Altrincham, GB;

Attorney:

Womble Bond Dickinson (US) LLP

Primary Examiner:

Davienne N Monbleau

Assistant Examiner:

Heim Kirin Grewal

Int. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H10F 71/00 (2025.01);
U.S. Cl.
CPC ...
H10H 20/018 (2025.01); H10F 71/127 (2025.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 21/7806 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01);
Abstract

A method of preparing a device coupon for a micro-transfer printing process from a multi-layered stack located on a device wafer substrate. The multi-layered stack comprises a plurality of semiconductor layers. The method comprises steps of: (a) etching the multi-layered stack to form a multi-layered device coupon, including an optical component; and (b) etching a semiconductor layer of the multi-layered device coupon to form one or more tethers, said tethers securing the multi-layered device coupon to one or more supports.

Find Patent Forward Citations

Yu, Guomin. (2026). Method of preparing a device coupon for micro-transfer printing, device wafer including said device coupon, and optoelectronic device manufactured from said device wafer (U.S. Patent No. 12532574). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532574

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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