The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Mar. 29, 2021
Applicant:

Soitec, Bernin, FR;

Inventors:

Trong Huynh-Bao, Ottawa, CA;

Bich-Yen Nguyen, Austin, TX (US);

Christophe Maleville, Lumbin, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01); H01L 29/423 (2006.01); H10D 64/27 (2025.01); H10D 86/00 (2025.01); H10D 86/01 (2025.01);
U.S. Cl.
CPC ...
H10D 86/01 (2025.01); H01L 21/76281 (2013.01); H10D 64/518 (2025.01); H10D 86/201 (2025.01);
Abstract

A method for manufacturing a semiconductor-on-insulator (SeOI) chip comprises: a) providing a SeOI structure, b) building a plurality of isolated field effect transistors (FET) each comprising: —a preliminary gate above a channel region, the FETs from a first group having a first preliminary gate length and the FETs from a second group having a smaller second preliminary gate length, —a source region and a drain region, and —a source electrode and a drain electrode, c) removing at least the preliminary gates of the FETs from the second group, leaving access to channel regions of the FETs, d) thinning a top layer in channel regions of the FETs from the second group, the top layer in channel regions of the first group of FETs having a different thickness, and e) forming functional gates simultaneously on channel regions of the FETs whose preliminary gates were removed.


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