The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Apr. 27, 2023
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Susumu Kagohashi, Ogaki, JP;

Jun Sakai, Ogaki, JP;

Kyohei Yoshikawa, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05H 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/03 (2013.01); H05K 1/0313 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the inorganic particles include first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin, the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin respectively, and the first surface of the resin insulating layer includes a surface of the resin and surfaces of the first portions exposed from the surface of the resin.


Find Patent Forward Citations

Kagohashi, Susumu. (2026). Printed wiring board (U.S. Patent No. 12532413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532413

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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