The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Dec. 08, 2023
Applicant:
Electronic Design & Development, Corp., Tucson, AZ (US);
Inventor:
Sergio E. Cardona, Jr., Tucson, AZ (US);
Assignee:
ELECTRONIC DESIGN & DEVELOPMENT, CORP., Tucson, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H05K 1/0237 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A hermetic glass module for wireless communication. The module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.