The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Aug. 30, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seongki Jeong, Suwon-si, KR;

Jingook Kim, Suwon-si, KR;

Chijoon Kim, Suwon-si, KR;

Seungwhee Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G06F 1/1652 (2013.01); H05K 1/181 (2013.01); H05K 3/4038 (2013.01); H05K 5/0026 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/05 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/1147 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a hinge, a first housing having at least a portion coupled to a first side of the hinge and including a first substrate assembly, a second housing having at least a portion coupled to a second side of the hinge, including a second substrate assembly, and configured to be foldable and unfoldable, a flexible display supported on the first and second housing and configured to be foldable and unfoldable, an FPCB electrically connecting the first and second substrate assembly, a through hole formed in the first housing forming a path through which the at least one FPCB passes, a first sealing member disposed so as to compress a first side surface of the at least one FPCB disposed in the through hole, and a second sealing member presses the second side surface of the FPCB disposed in the through hole.


Find Patent Forward Citations

Loading…