The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
May. 11, 2023
Hl Klemove Corp., Incheon, KR;
Hl Mando Corporation, Pyeongtaek-si, KR;
Jihoon Han, Incheon, KR;
Sanghyun Jin, Incheon, KR;
Minha Lee, Incheon, KR;
Kunju Koh, Incheon, KR;
Seungcho Han, Namyangju-si, KR;
HL KLEMOVE CORP., Incheon, KR;
HL MANDO CORPORATION, Pyeongtaek -si, KR;
Abstract
A heat dissipation structure of a printed circuit board in which a heating element is disposed on one surface thereof and a heat sink is disposed on another surface thereof is provided, The heat dissipation structure includes a heat dissipation hole passing through the printed circuit board in a thickness direction of the printed circuit board, a thermal interface material arranged between the other surface of the printed circuit board and one surface of the heat sink, a bead interposed between the other surface of the printed circuit board and the one surface of the heat sink to form a gap between the printed circuit board and the heat sink, and at least one solder dome disposed on the other surface of the printed circuit board so that a minimum gap between the printed circuit board and the heat sink is secured when the bead collapses.