The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Sep. 14, 2023
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

I-Chen Lin, Taipei, TW;

Yao Cheng Yang, Taipei, TW;

Yung-Chang Wei, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 1/00 (2006.01);
U.S. Cl.
CPC ...
H04L 1/0026 (2013.01); H04L 1/0068 (2013.01);
Abstract

An example wireless networking device (e.g., Access point) dynamically managing preamble puncturing for OFDM-based communications. The wireless networking device determines first criteria of a signal quality and further determines to allow preamble puncturing, wherein the signal quality of the determines the occupancy of a subchannel. Based on the determination to preamble puncture, apply dynamically, preamble puncturing to an adjacent subchannel. The wireless networking device further monitors the subchannel signal quality and determines based on a second criteria, an amount of bandwidth useable from an adjacent bandwidth. The wireless networking device, based on the second criteria, dynamically allocate bandwidth from the adjacent subchannel.


Find Patent Forward Citations

Lin, I-Chen. (2026). Preamble puncturing bandwidth allocation (U.S. Patent No. 12531651). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12531651

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…