The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Apr. 20, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Hiromichi Kitajima, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A radio frequency module includes a module substrate having a first principal surface and a second principal surface, a resin member covering the first principal surface and side surfaces of first and second components disposed on the first principal surface, a metal shield layer covering an upper surface of the resin member, a metal shield wall disposed on the first principal surface, a metal member disposed on the second principal surface, and a via conductor penetrating the module substrate. The metal shield wall is disposed between the first component and the second component when the first principal surface is viewed in plan. An upper end of the metal shield wall is connected to the metal shield layer. The via conductor electrically connects the metal shield wall and the metal member, and at least partially overlaps each of the metal shield wall and the metal member when viewed in plan.