The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Mar. 06, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Yukihiko Wada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/49 (2013.01); H02M 7/53871 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/13055 (2013.01);
Abstract

In this semiconductor device, an emitter electrode of a power semiconductor element includes a first sub-electrode provided in a region including a central portion of a front surface of a semiconductor substrate and a second sub-electrode provided in a region not including the central portion of the front surface of the semiconductor substrate. A first bonding wire connects the first sub-electrode and an emitter terminal. A second bonding wire connects the second sub-electrode and the emitter terminal. First and second voltage detectors detect voltages between the emitter terminal and the first and second sub-electrodes, respectively. It is possible to separately detect degradation of both the first bonding wire that degrades in an early period and the second bonding wire that degrades in a terminal period.


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