The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Dec. 21, 2022
Industrial Technology Research Institute, Hsinchu, TW;
Yu-Hung Pai, Hsinchu, TW;
Hung-Tsai Wu, Hsinchu, TW;
He-Chen Liao, Hsinchu, TW;
Kai-Jhih Yang, Hsinchu, TW;
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Abstract
A mold state monitoring system is provided, and the monitoring method thereof is: dividing multiple processing signals of a mold into initial state information and wear state information, so as to obtain a target model and a wear threshold based on the initial state information, and input the wear state information into the target model to obtain a wear index of the mold; inputting the latest multiple processing signals and corresponding wear indices thereof into a time series prediction model for training to obtain wear prediction values of hypothetical times, and then performing a predicting operation based on the wear prediction value, so that when the wear prediction value is greater than the wear threshold, it can be estimated as a damage time point of the mold. Therefore, via the design of the time series prediction model, the target information can be changed at any time on the production line, and the state of the mold can be monitored online in real time.