The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jun. 24, 2021
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Inventors:

Hsiao-Ting Hsu, New Taipei, TW;

Fu-Yun Shen, Shenzhen, CN;

Ming-Jaan Ho, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01L 1/22 (2006.01);
U.S. Cl.
CPC ...
G01L 1/2287 (2013.01);
Abstract

The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.


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