The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jun. 21, 2024
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Shih-Lin Huang, Taoyuan, TW;

Xiaojun Chen, Taoyuan, TW;

Guangshuai Wang, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0283 (2013.01); F28D 15/0233 (2013.01);
Abstract

A manufacturing method of a heat pipe structure is provided. Firstly, a step Sis performed. An original heat pipe structure is provided. The original heat pipe structure includes an enclosed space in a sealed state and an original wick structure disposed within the enclosed space. Then, a step Sis performed. Portion of the original heat pipe structure is deformed to form a deformation portion. The deformation portion clamps portion of the original wick structure. The enclosed space is separated into two subspaces. Then, a step Sis performed. The deformation portion is cut to separate the two subspaces to form two heat pipe structures.


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