The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jul. 19, 2022
Applicant:

Integran Technologies Inc., Mississauga, CA;

Inventor:

Klaus Tomantschger, Mississauga, CA;

Assignee:

Integran Technologies Inc., Mississauga, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/10 (2006.01); C25D 5/00 (2006.01); C25D 5/16 (2006.01); C25D 15/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/10 (2013.01); C25D 5/16 (2013.01); C25D 5/617 (2020.08); C25D 15/00 (2013.01);
Abstract

Articles including anisotropic electrodeposited layers of fine-grained alloys of Co, Cu, Fe, Ni and/or Zn with minor additions of B, O, P and S that provide high strength, ductility and heat-resistance, are disclosed as well as a process for making the articles. Non-metallic additions of ≤2% are required to significantly increase the maximum temperature at which softening and grain-growth occurs. Electrodeposition conditions in a single plating cell are adjusted and/or modulated to vary at least one property in the deposit direction and/or along the length and/or width of the workpiece once, constantly or repeatedly, to form a graded and/or layered electrodeposit. Variable property metallic material deposits containing, at least in part, a fine-grained microstructure and variable property in the deposit direction and optionally multi-dimensionally, provide superior overall mechanical properties and temperature stability. Various methods and electroplating apparatuses and approaches to practice the invention are also provided.


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