The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Dec. 18, 2020
Film forming method, polyphenylene sulfide powder coating material, coating film, and coated article
Daikin Industries, Ltd., Osaka, JP;
Yasukazu Nakatani, Osaka, JP;
Shichou Chin, Osaka, JP;
Toshio Miyatani, Osaka, JP;
Hirotake Imada, Osaka, JP;
Yukari Honda, Osaka, JP;
DAIKIN INDUSTRIES, LTD., Osaka, JP;
Abstract
Provided is a film forming method that can form a film having a thickness of 500 μm or more with a single coating of a substrate. The present disclosure is a film forming method using a powder coating material containing a polyphenylene sulfide resin, the method including heating the powder coating material at a temperature equal to or higher than a melting point of the polyphenylene sulfide resin and within a range of 250 to 400° C., in which a single coating of a substrate forms a film having a thickness of 500 μm or more; and the obtained film has a surface roughness, Ra, of 0.30 μm or less.