The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Mar. 25, 2022
Sekisui Chemical Co., Ltd., Osaka, JP;
Yoshifumi Sugisawa, Osaka, JP;
Takashi Watanabe, Osaka, JP;
Mitsuru Tanikawa, Osaka, JP;
Yusuke Fujita, Osaka, JP;
Taichi Hamada, Osaka, JP;
Tomoya Tanaka, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
Provided is an ink-jet adhesive that can suppress adhesion of an adhesive component to an unintended region of a transparent member when the transparent member is used as a member to be bonded. The ink-jet adhesive according to the present invention contains a photocurable compound having a (meth) acryloyl group or a vinyl group and having no cyclic ether group, and a photopolymerization initiator, contains or does not contain a thermosetting compound having no (meth) acryloyl group and having a cyclic ether group, and a content of the thermosetting compound is 5 wt % or less when the ink-jet adhesive contains the thermosetting compound.