The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
May. 16, 2023
Applicant:
Nike, Inc., Beaverton, OR (US);
Inventor:
Stephane Bazzana, Beaverton, OR (US);
Assignee:
NIKE, Inc., Beaverton, OR (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 75/04 (2006.01); C08G 18/28 (2006.01); C08G 18/32 (2006.01); C08G 18/40 (2006.01); C08G 18/48 (2006.01); C08G 18/61 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C08G 101/00 (2006.01); C08J 5/04 (2006.01); C08J 5/10 (2006.01); C08J 5/18 (2006.01); C08J 11/06 (2006.01); C08K 9/10 (2006.01); C08K 11/00 (2006.01); C08K 13/04 (2006.01);
U.S. Cl.
CPC ...
C08L 75/04 (2013.01); C08G 18/288 (2013.01); C08G 18/3206 (2013.01); C08G 18/4009 (2013.01); C08G 18/4833 (2013.01); C08G 18/61 (2013.01); C08G 18/6677 (2013.01); C08G 18/7671 (2013.01); C08J 5/046 (2013.01); C08J 5/10 (2013.01); C08J 5/18 (2013.01); C08J 11/06 (2013.01); C08K 9/10 (2013.01); C08K 11/005 (2013.01); C08K 13/04 (2013.01); C08G 2101/00 (2013.01); C08G 2350/00 (2013.01); C08J 2300/24 (2013.01); C08J 2375/04 (2013.01); C08J 2425/08 (2013.01); C08J 2431/04 (2013.01); C08L 2207/04 (2013.01); C08L 2207/24 (2013.01);
Abstract
The present disclosure provides for articles formed of a filled polymeric resin material. More specifically, the present disclosure relates to polymeric resin materials that include a filler that includes of a mixture of cured rubber granules, foam granules, and/or textile fibers. The filler can be suspended in and/or encapsulated by the polymeric resin material. The polymeric resin material, the filler, or both can include waste or scrap material from manufacturing or from ground post-consumer waste.