The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
May. 20, 2021
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Kentaro Hayasaka, Tokyo, JP;
Tomoya Taniyama, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/04 (2006.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
C08L 9/04 (2013.01); C08L 75/04 (2013.01);
Abstract
A latex composition for dip molding including a latex of a conjugated diene polymer (A) having a methyl ethyl ketone insolubles content of 50% by weight or less, and a latex of a polymer (B) having a methyl ethyl ketone insolubles content of 55% by weight or more.
Hayasaka, Kentaro. (2026). Latex composition for dip molding and dip-molded article (U.S. Patent No. 12528935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12528935
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile