The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Nov. 24, 2021
Toray Industries, Inc., Tokyo, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A prepreg is described having good handleability and a low resin flow, facilitating the work in the process of a molded body and improving the dimensional accuracy of the molded body, where the prepreg includes a fiber substrate; and a resin layer containing a thermosetting resin composition containing at least components [A] (thermosetting resin) and [B] (curing agent of [A]), stacked on one surface of the fiber substrate, wherein the fiber substrate is impregnated with a part of the thermosetting resin composition of the resin layer, the thermosetting resin composition having a complex viscosity η3*24 at 24° C. of 20,000 to 100,000 Pa·s and a complex viscosity η3*70 at 70° C. of 100 to 5,000 Pa·s, and a volatile amount of the thermosetting resin composition is 1 mass % or less when a total mass of the prepreg is 100 mass %.