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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12528919 B1

PDFFull Text
Date of Patent:
Jan. 20, 2026

Filed:

Sep. 28, 2018

Master batch for expansion molding and foam molded body

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventor:

Yusaku Uchiyama, Yamaguchi, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Christina HW. Rosebach

Int. Cl.
CPC ...
C08J 3/22 (2006.01); B29C 44/34 (2006.01); C08J 9/32 (2006.01); B29K 27/00 (2006.01); B29K 33/00 (2006.01); B29K 33/20 (2006.01);
U.S. Cl.
CPC ...
C08J 3/22 (2013.01); B29C 44/3461 (2013.01); B29C 44/355 (2013.01); C08J 9/32 (2013.01); B29K 2027/08 (2013.01); B29K 2033/08 (2013.01); B29K 2033/20 (2013.01); C08J 2203/22 (2013.01); C08J 2327/08 (2013.01); C08J 2333/08 (2013.01); C08J 2333/20 (2013.01);
Abstract

The present invention aims to provide a masterbatch for foam molding which can be suitably used in molding involving high shear force or molding requiring low molding temperature and which can provide a foam molded article having a high expansion ratio and good appearance quality. The present invention also aims to provide a foam molded article formed from the masterbatch for foam molding. Provided is a masterbatch for foam molding, containing: a base resin; and a thermally expandable microcapsule, the masterbatch having a true specific gravity of 0.80 g/cmor more, the base resin containing an olefin elastomer, the masterbatch containing the thermally expandable microcapsule in an amount of 40 to 300 parts by weight relative to 100 parts by weight of the base resin.

Find Patent Forward Citations

Uchiyama, Yusaku. (2026). Master batch for expansion molding and foam molded body (U.S. Patent No. 12528919). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12528919

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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