The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jul. 26, 2023
Applicant:

Raysolve Optoelectronics (Suzhou) Company Limited, Suzhou, CN;

Inventor:

Wing Cheung Chong, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); G09G 3/32 (2016.01); H10H 20/01 (2025.01); H10H 20/811 (2025.01); H10H 20/854 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); G09G 3/32 (2013.01); H10H 20/01 (2025.01); H10H 20/811 (2025.01); H10H 20/854 (2025.01); H10H 20/0364 (2025.01);
Abstract

A method for manufacturing a light emitting diode (LED) structure is provided. A driving circuit having a plurality of contact pads is formed in a first substrate. A plurality of metal contacts is formed on the first substrate, each metal contact being located on one of the plurality of contact pads. A nonconductive adhesive layer is formed on the first substrate covering the plurality of contact pads and the plurality of metal contacts. A plurality of LED units is formed on the nonconductive adhesive layer. Each LED unit is electrically connected to one of the plurality of contact pads through one of the plurality of metal contacts.


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