The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Dec. 13, 2024
Applicants:

Imec Vzw, Leuven, BE;

Universiteit Hasselt, Hasselt, BE;

Inventor:

Marc Meuris, Keerbergen, BE;

Assignees:

IMEC VZW, Leuven, BE;

Universiteit Hasselt, Hasselt, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 19/70 (2025.01); H10D 8/60 (2025.01); H10D 80/20 (2025.01); H10F 19/90 (2025.01);
U.S. Cl.
CPC ...
H10F 19/70 (2025.01); H10D 8/60 (2025.01); H10D 80/231 (2025.01); H10F 19/902 (2025.01);
Abstract

A bypass diode assembly and a method for fabricating the bypass diode assembly are provided, the bypass diode assembly comprising an electrically insulating tape, an electrically conductive ribbon extending over the back side of the tape and locally exposed at the front side of the tape through an opening, a semiconductor component positioned in a hole through the tape, wherein the semiconductor component comprises a diode electrically connected between a first contact pad of the semiconductor component in electrical contact with the electrically conductive ribbon and a second contact pad of the semiconductor component, and an electrically conductive ribbon portion on the front side of the tape in electrical contact with the second contact pad of the semiconductor component. The electrically conductive ribbon portion is electrically isolated from the first electrically conductive ribbon by the electrically insulating tape. A photovoltaic module comprising at least one bypass diode assembly is provided.


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