The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Oct. 21, 2022
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Lars Müller-Meskamp, Dresden, DE;

Ralf Rudolf, Dresden, DE;

Dirk Priefert, Moers, DE;

Annett Winzer, Dresden, DE;

Thomas Künzig, Baldham, DE;

Christian Schippel, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 87/00 (2025.01); H01L 21/762 (2006.01); H10D 30/60 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10D 87/00 (2025.01); H01L 21/76267 (2013.01); H01L 21/76283 (2013.01); H10D 30/601 (2025.01); H10D 62/102 (2025.01);
Abstract

A semiconductor device includes a semiconductor layer with an inner portion, an outer portion laterally surrounding the inner portion, and a transition portion laterally surrounding the inner portion and separating the inner portion and the outer portion. A first electric element includes a first doped region formed in the inner portion and a second doped region formed in the outer portion. The first electric element is configured to at least temporarily block a voltage applied between the first doped region and the second doped region. A trench isolation structure extends from a first surface into the semiconductor layer and segments at least one of the inner portion, the transition portion, and the outer portion.


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