The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jan. 07, 2022
Applicant:

Innoscience (Suzhou) Technology Co., Ltd., Suzhou, CN;

Inventors:

Wuhao Gao, Suzhou, CN;

Qiyue Zhao, Suzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/27 (2025.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10D 30/01 (2025.01); H10D 30/47 (2025.01); H10D 62/10 (2025.01); H10D 84/01 (2025.01); H10D 84/82 (2025.01); H10D 62/824 (2025.01);
U.S. Cl.
CPC ...
H10D 64/529 (2025.01); H01L 23/5226 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H10D 30/015 (2025.01); H10D 30/475 (2025.01); H10D 62/107 (2025.01); H10D 84/0123 (2025.01); H10D 84/82 (2025.01); H10D 62/824 (2025.01);
Abstract

A nitride-based semiconductor circuit including a substrate structure, a nitride-based heterostructure, connectors, and connecting vias is provided. The substrate structure includes a first type semiconductor substrate, and a second type semiconductor substrate. The second type semiconductor substrate is embedded in a region of the first type semiconductor substrate. The first type semiconductor substrate has first dopants, and the second type semiconductor substrate has second dopants to form a pn junction between the first type semiconductor substrate and the second type semiconductor substrate. The nitride-based heterostructure is disposed on the substrate structure. The connectors are disposed on the nitride-based heterostructure. The connecting vias include a first interconnection and a second interconnection. The first interconnection electrically connects the first region of the first type semiconductor substrate to one of the connectors. The second interconnection electrically connects the second type semiconductor substrate to another one of the connectors.


Find Patent Forward Citations

Gao, Wuhao. (2026). Nitride-based semiconductor circuit and method for manufacturing the same (U.S. Patent No. 12527063). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12527063

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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