The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Dec. 11, 2023
Applicant:
Lite-on Technology Corporation, Taipei, TW;
Inventor:
Chien-Hsiung Tsao, Taipei, TW;
Assignee:
Lite-On Technology Corporation, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01F 27/02 (2006.01); H01G 2/08 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20472 (2013.01); H01F 27/025 (2013.01); H01G 2/08 (2013.01); H01L 23/3735 (2013.01);
Abstract
A heat dissipation module including an electronic component, a first heat dissipation component and a first thermal adhesive sheet, is provided. The electronic component has a first surface. The first heat dissipation component has a second surface facing the first face. The first thermal adhesive sheet is disposed between the first surface of the electronic component and the second surface of the first heat dissipation component, so as to fix the first heat dissipation component to the electronic component. Another heat dissipation module is also provided.