The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Apr. 12, 2023
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Chander Prakash Gupta, Gurugram, IN;

Sachin Singla, Gurugram, IN;

Suyash Agrawal, Gurugram, IN;

Ranjeet Chaurasiya, Gurugram, IN;

Karan Goel, Gurugram, IN;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); H05K 5/03 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1432 (2013.01); H05K 5/03 (2013.01); H05K 7/1407 (2013.01); H05K 7/1492 (2013.01); H05K 7/20409 (2013.01); H05K 7/209 (2013.01);
Abstract

A networking equipment enclosure assembly, including: a base chassis; a lid coupled to the base chassis; a printed circuit board disposed within the base chassis; and a power supply unit disposed between the printed circuit board and the lid, wherein the power supply unit is spaced apart from and biased away from the printed circuit board and towards the lid via a spring mechanism coupled between the printed circuit board and the power supply unit. The networking equipment enclosure assembly also includes a heat spreader plate disposed between the power supply unit and the lid and coupled to the power supply unit. The power supply unit is biased towards the lid via the spring mechanism coupled between the printed circuit board and the power supply unit such that the heat spreader plate is pressed into thermal contact with the lid.


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