The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jun. 23, 2022
Applicant:
Meta Platforms, Inc., Menlo Park, CA (US);
Inventor:
Pradip Sairam Pichumani, Bellevue, WA (US);
Assignee:
Meta Platforms, Inc., Menlo Park, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/522 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/5223 (2013.01); H05K 1/111 (2013.01); H05K 3/303 (2013.01); H05K 3/3452 (2013.01); H05K 3/4007 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10492 (2013.01); H05K 2203/0415 (2013.01);
Abstract
A system that includes improved integrated circuit interconnects integrated with interconnect capacitors that reduce noise and improve signal quality is disclosed. The system comprises a first circuit board layer including a contact region of a conductor trace. The system further comprises a second layer including an interconnect capacitor, wherein the interconnect capacitor comprises a first side coupled over at least a portion of the contact region of the first circuit board layer to form a contact pad on a second side of the interconnect capacitor configured to interface with an integrated circuit chip.