Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same

Abstract

A method for making a superconducting, electrically conductive solder column that is mechanically compliant and capable of operating at low cryogenic temperatures for quantum computing and AI computing in datacenters and at elevated temperatures for applications found in extraterrestrial space exploration. The solder column can have an indium alloy core and a surface covered by a braided structure comprising a plurality of small diameter niobium wires coated with a thin layer of indium-alloy. The niobium braided structure can limit deformation of the indium alloy core when the solder column structure is subjected to elevated temperatures exceeding a liquidus temperature of the indium alloy core during the coating process and during post-manufacturing operations. The braided niobium wires can limit the deformation of the indium alloy core when the column structure falls below the ductile to brittle transition temperature during exposure to low cryogenic temperatures.