The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Nov. 27, 2024
Applicant:

Resnent, Llc, Bloomington, IL (US);

Inventors:

Willard S. Noyes, Bloomington, IL (US);

Benjamin Joseph Gray, Portland, ME (US);

Assignee:

RESNENT, LLC, Bloomington, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/06 (2006.01); A61B 17/00 (2006.01); A61B 17/29 (2006.01); H04N 7/18 (2006.01); H04N 23/50 (2023.01); H04N 23/51 (2023.01);
U.S. Cl.
CPC ...
H04N 23/555 (2023.01); A61B 1/0005 (2013.01); A61B 1/00066 (2013.01); A61B 1/00105 (2013.01); A61B 1/00124 (2013.01); A61B 1/053 (2013.01); A61B 1/0676 (2013.01); A61B 17/29 (2013.01); H04N 7/185 (2013.01); H04N 23/51 (2023.01); A61B 1/00114 (2013.01); A61B 2017/00296 (2013.01); A61B 2017/0046 (2013.01);
Abstract

The technology described herein is directed toward a detachable, powered, modular endoscope system with interconnected components and coupling mechanisms that enable power or data signal connectivity between many different detachable instruments, devices, and endoscope shaft variations. In some implementations, an endoscope assembly includes: an endoscope housing comprising first circuitry configured to receive one or more data signals, and second circuitry configured to supply power; and a rigid attachment segment distally extending from the endoscope housing, the rigid attachment segment including: third circuitry configured to electrically couple the rigid attachment segment to the first and second circuitry of the endoscope housing, and one or more surfaces configured to be removably, mechanically, and electrically coupled to an instrument, adapter, or cable, the instrument, adapter, or cable configured to receive power from the endoscope housing or transmit data signals to the endoscope housing when electrically coupled to the one or more surfaces.


Find Patent Forward Citations

Noyes, Willard. (2026). Modular endoscope assembly (U.S. Patent No. 12526504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12526504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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