Imaging lens module and electronic device with hardness-controlled isolating article and plastic molding article

Abstract

An imaging lens module includes a sensing part, a lens assembly, a lens holding member, an isolating article and a plastic molding article. The sensing part includes a substrate, a sensing chip and a plurality of conducting wires. The substrate supports the sensing chip. The sensing chip includes an optical effect area and an electrical connection area. The conducting wires are electrically connected to the electrical connection area for transmitting an image signal. The lens assembly corresponds to the optical effect area. The lens holding member holds the lens assembly. The lens holding member includes a wire correspondence structure corresponding to the conducting wires. The isolating article is between the wire correspondence structure and the conducting wires. The plastic molding article is molded on the sensing part. The plastic molding article physically contacts the lens holding member to fix the lens holding member with respect to the sensing part.