The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Apr. 14, 2023
Murata Manufacturing Co., Ltd., Kyoto, JP;
Teruaki Oshita, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
To provide a high-frequency module that can be reduced in size while securing an external connection member. A high-frequency module includes a mounting substrate, an electronic component, and a resin layer. The electronic component is mounted on a main surface of the mounting substrate. The resin layer is provided on the mounting substrate and covers a side surface of the electronic component. The electronic component includes a connection terminal, a conductor layer, and a through-via. The connection terminal is provided on a main surface of the electronic component on the mounting substrate side, and is connected to the mounting substrate through a connection member. The conductor layer is provided on a main surface of the electronic component on a side opposite to the mounting substrate side. The through-via penetrates between the main surface and the main surface of the electronic component to connect the connection terminal and the conductor layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile