The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jun. 08, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Yukiya Yamaguchi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H03F 3/195 (2013.01); H03F 2200/294 (2013.01); H03F 2203/21157 (2013.01);
Abstract

A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplification transistor formed on a side of the major surface of the base material; and a metal electrode placed on the major surface and connected to the amplification transistor.


Find Patent Forward Citations

Yamaguchi, Yukiya. (2026). High-frequency module and communication device (U.S. Patent No. 12525932). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12525932

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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