The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Nov. 08, 2022
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Paul R. Taylor, Mechanicsburg, PA (US);

Jim Hileman, Carlisle, PA (US);

Trent K. Do, Lititz, PA (US);

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/24 (2006.01); H01L 23/498 (2006.01); H01R 12/00 (2006.01); H01R 12/51 (2011.01); H01R 12/55 (2011.01); H01R 12/71 (2011.01); H01R 12/57 (2011.01); H01R 12/58 (2011.01); H01R 33/74 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 13/2435 (2013.01); H01L 23/49838 (2013.01); H01R 12/00 (2013.01); H01R 12/51 (2013.01); H01R 12/55 (2013.01); H01R 12/714 (2013.01); H01R 13/2457 (2013.01); H01R 12/57 (2013.01); H01R 12/58 (2013.01); H01R 12/585 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 13/24 (2013.01); H01R 13/2414 (2013.01); H01R 13/2464 (2013.01); H01R 13/2485 (2013.01); H01R 33/74 (2013.01); H05K 1/181 (2013.01); H05K 2201/10621 (2013.01); H05K 2201/10628 (2013.01);
Abstract

An interposer configured for connecting offset arrays of signal pads on parallel surfaces. Contacts of the interposer have mating portions with multiple beams. One of the beams makes contact with a pad on a first of the surfaces and is deflected when the surfaces are pressed together with the interposer between them. A second of the beams is positioned so that the first beam presses into that second beam as the first beam deflects. The second beam may contact a central location on the first beam. An electrical path through the contact from a pad on the first surface to a pad on the second surface may be shorter when the first beam is pressed into the second beam than through the first beam alone. A shorter path may improve signal integrity. Moreover, the spring force of the contact may be set by the second beam.


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