The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Sep. 01, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jeahyeong Han, San Diego, CA (US);

Sang-June Park, San Diego, CA (US);

Sanjaya Kumar Khatua, Hyderabad, IN;

Darryl Sheldon Jessie, Star, ID (US);

Rajneesh Kumar, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/10 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/10 (2013.01); H01Q 1/38 (2013.01); H01Q 21/061 (2013.01);
Abstract

A package comprising a substrate, an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects. The antenna device comprises an antenna device dielectric layer; at least one antenna located on a first surface of the antenna device dielectric layer; a shield located on at least one lateral surface of the antenna device; and a slot opening on the first surface of the antenna device.


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