The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Dec. 01, 2022
Nanya Technology Corporation, New Taipei, TW;
Wu-Der Yang, Taoyuan, TW;
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Abstract
A semiconductor package includes a first substrate, a first semiconductor chip, a first bonding wire, a second substrate, a second semiconductor chip and a second bonding wire. The first substrate has a window through a center portion of the first substrate. The first semiconductor chip is located on the first substrate. The first bonding wire is in the window of the first substrate and electrically connects to the first semiconductor chip and the first substrate. The second substrate is located on the first semiconductor chip, and has a window through a center portion of the second substrate. The second substrate electrically connects to the first substrate. The second semiconductor chip is located on the second substrate. The second bonding wire is in the window of the second substrate and electrically connects to the second semiconductor chip and the second substrate.