The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jul. 01, 2021
Applicant:
Resonac Corporation, Tokyo, JP;
Inventors:
Kohei Taniguchi, Tokyo, JP;
Yoshinobu Ozaki, Tokyo, JP;
Kei Itagaki, Tokyo, JP;
Kazuhiro Yamamoto, Tokyo, JP;
Kanami Nakamura, Tokyo, JP;
Hiroki Hashimoto, Tokyo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/31 (2006.01); H10B 41/20 (2023.01); H10B 43/20 (2023.01); H10B 80/00 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3142 (2013.01); H10B 41/20 (2023.02); H10B 43/20 (2023.02); H10B 80/00 (2023.02);
Abstract
A semiconductor device includes: a substrate; an adhesive member arranged on a surface of the substrate; a first chip stacked on the adhesive member with a first adhesive piece interposed therebetween; and a second chip stacked on the first chip with a second adhesive piece interposed therebetween. The adhesive member has a multilayer structure including a pair of surface layers formed of a cured product of a thermosetting resin composition and an intermediate layer arranged between the pair of surface layers.