The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Mar. 16, 2022
Applicant:

Wavepia Co., Ltd., Gyeonggi-do, KR;

Inventors:

Sang-Hun Lee, Gyeonggi-do, KR;

Sang-Yeol Lee, Gyeonggi-do, KR;

Sang-Soo Kim, Gyeonggi-do, KR;

Assignee:

WAVEPIA CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/48138 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/15153 (2013.01);
Abstract

A radio frequency (RF) chip package includes: an RF die; a first peripheral circuit chip; a second peripheral circuit chip; a substrate having a-shaped step formed on a portion thereof so that the RF die is mounted on top of the step of the substrate and the first peripheral circuit chip and the second peripheral circuit chip are mounted on top of the substrate where no step is formed; a first mutual inductance controller for controlling the dimension of the mutual inductance between the first peripheral circuit chip and the RF die; and a second mutual inductance controller for controlling the dimension of the mutual inductance between the second peripheral circuit chip and the RF die.


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