The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Feb. 08, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chanro Park, Clifton Park, NY (US);

Yann Mignot, Slingerlands, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76819 (2013.01); H01L 21/76829 (2013.01); H01L 21/76877 (2013.01);
Abstract

An integrated circuit structure includes a metal line that has an upper surface defining a periphery; a dielectric spacer that is formed around the periphery of the upper surface of the metal line; and a metal via that contacts the metal line and the dielectric spacer adjacent to the periphery of the upper surface. A method for making a semiconductor structure includes depositing a spacer around the periphery of an upper surface of a metal line; and depositing a via onto the metal line, so that a part of the via overlaps the spacer.


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