The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Oct. 09, 2023
Applicant:
Stmicroelectronics (Grenoble 2)sas, Grenoble, FR;
Inventors:
Romain Coffy, Voiron, FR;
Fabien Quercia, Saint Marcelin, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.