The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Jun. 05, 2023
Applicant:
Semiconductor Components Industries, Llc, Scottsdale, AZ (US);
Inventors:
Chee Hiong Chew, Seremban, MY;
Yushuang Yao, Shenzhen, CN;
Atapol Prajuckamol, Thanyaburi, TH;
Chuncao Niu, Wuhan, CN;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/40 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/562 (2013.01); H05K 1/184 (2013.01); H01L 2023/4087 (2013.01);
Abstract
A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.