The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Sep. 06, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventor:

Atsushi Tanaka, Himeji Hyogo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49551 (2013.01); H01L 23/49524 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 2224/291 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes: a first frame; a first chip on the first frame; a second frame spaced apart from the first frame in a first direction; a second chip on the second frame; and a first joint terminal above the second chip. The first frame includes a first terminal portion extending toward the second frame. The first joint terminal includes a second terminal portion extending toward the first frame. The second terminal portion includes first and second projecting portions each of which projects toward the first frame and which are spaced apart from each other in a second direction. An end portion of the first projecting portion and an end portion of the second projecting portion are each joined on the first terminal portion.


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