The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Oct. 20, 2020
Mitsubishi Electric Corporation, Tokyo, JP;
Yasuhiro Sakai, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor device in which a bonding state between a bonding object and a terminal is improved. The semiconductor device includes a bonding object, a case, and a terminal. The bonding object includes a metal pattern. The case includes a frame body and accommodates the bonding object inside the frame body. The terminal includes a first end and a second end. The first end is bonded to the metal pattern of the bonding object. The second end is led out of the case from the first end. The bonding object is an insulating substrate or a semiconductor element held on an insulating substrate. The case includes a beam bridging across a space inside frame body. The beam holds a portion of the terminal between the first end and the second end.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile