The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Feb. 02, 2023
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Guillaume Alexandre Blin, Carlisle, MA (US);
Engin Ibrahim Pehlivanoglu, Costa Mesa, CA (US);
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); G01R 1/073 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 23/525 (2006.01); H01L 23/58 (2006.01); H10B 20/25 (2023.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); G01R 1/07342 (2013.01); G01R 31/2601 (2013.01); G01R 31/2884 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 22/34 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 25/0655 (2013.01); H01L 23/5256 (2013.01); H10B 20/25 (2023.02);
Abstract
A semiconductor wafer comprising a first die including a first integrated circuit having a trimmable or programmable component. The trimmable or programmable component is configured to be trimmed or permanently altered in response to an electrical signal. The semiconductor wafer also includes a saw street arranged adjacent to the first die, and at least one probe pad electrically connected to the trimmable or programmable component. The at least one probe pad is arranged in the saw street.