The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Jan. 17, 2024
Applicant:

Innolux Corporation, Miaoli County, TW;

Inventors:

Hsiao-Lang Lin, Miaoli County, TW;

Jui-Jen Yueh, Miaoli County, TW;

Assignee:

Innolux Corporation, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/044 (2006.01); H10K 59/40 (2023.01); H10K 59/131 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
G06F 3/0412 (2013.01); G06F 3/04164 (2019.05); G06F 3/0443 (2019.05); G06F 3/0446 (2019.05); H10K 59/40 (2023.02); G06F 2203/04103 (2013.01); H10K 59/131 (2023.02); H10K 59/873 (2023.02);
Abstract

An electronic device includes a substrate, a first insulating layer, a second insulating layer, a first conducting layer, a first conductive part, a second conductive part, a second conducting layer, and a third conductive part. The first insulating layer is disposed above the substrate and overlapped with a peripheral area of the substrate. The second insulating layer is disposed between the first insulating layer and the substrate. The first conducting layer is disposed above the first insulating layer. The first conductive part is disposed above the first insulating layer and overlapped with the peripheral area. The second conductive part is disposed between the first insulating layer and the second insulating layer and overlapped with the peripheral area. The second conducting layer is disposed between the second insulating layer and the substrate. The third conductive part is disposed between the second insulating layer and the substrate and overlapped with the peripheral area.


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