The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Mar. 02, 2022
Applicant:

Mektec Corporation, Tokyo, JP;

Inventors:

Shunsuke Tomita, Tokyo, JP;

Tomoki Kanayama, Tokyo, JP;

Yuki Komuro, Tokyo, JP;

Yusuke Hashimoto, Tokyo, JP;

Assignee:

MEKTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/22 (2006.01); G01K 1/08 (2021.01); G01K 1/14 (2021.01); H01M 10/48 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01K 7/22 (2013.01); G01K 1/08 (2013.01); G01K 1/14 (2013.01); H01M 10/486 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H01M 2220/20 (2013.01); H05K 2201/10022 (2013.01);
Abstract

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.


Find Patent Forward Citations

Loading…