The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Mar. 14, 2022
Applicant:

Zte Corporation, Shenzhen, CN;

Inventors:

Kaiwen Duan, Shenzhen, CN;

Shuai Li, Shenzhen, CN;

Xin Liu, Shenzhen, CN;

Fan Liu, Shenzhen, CN;

Zhidong Nie, Shenzhen, CN;

Yan Wang, Shenzhen, CN;

Mingming Zhao, Shenzhen, CN;

Assignee:

ZTE CORPORATION, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 1/03 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28D 1/0341 (2013.01); F28D 2021/0031 (2013.01);
Abstract

A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component provided in the heat collection cavity, the turbulation component comprising at least one turbulation piece; and a plurality of heat dissipation components connected to the base plate cover, wherein the heat dissipation components are provided with at least one heat dissipation pipeline, the heat dissipation pipeline is provided in communication with the heat collection cavity.


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