The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Aug. 15, 2023
GE Infrastructure Technology Llc, Greenville, SC (US);
Jon C. Schaeffer, Greenville, SC (US);
Srikanth C. Kottilingam, Greenville, SC (US);
GE Infrastructure Technology LLC, Greenville, SC (US);
Abstract
A method of forming a component. The method includes applying a thermal barrier coating to the component to facilitate decreasing heat transfer to the component, wherein the thermal barrier coating includes at least one thermal insulating layer and a metallic bond coat layer in contact with an outer surface of the component. The method also includes forming a plurality of grooves in the at least one thermal insulating layer of the thermal barrier coating to facilitate increasing a strain tolerance of the thermal barrier coating, wherein each of the plurality of grooves extends a depth into the at least one thermal insulating layer. The method further includes depositing a material within the plurality of grooves to facilitate increasing an amount of thermal protection of the metallic bond coat layer within those areas of the thermal barrier coating in which the plurality of grooves are formed.