logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12522749 B1

PDFFull Text
Date of Patent:
Jan. 13, 2026

Filed:

Apr. 07, 2023

Composition for semiconductor processing and manufacturing method of semiconductor device using the same

Applicant:

SK Enpulse Co., Ltd., Pyeongtaek-si, KR;

Inventors:

Seung Chul Hong, Seoul, KR;

Kangsik Myung, Seoul, KR;

Han Teo Park, Seoul, KR;

Deok Su Han, Seoul, KR;

Yongsoo Choi, Seoul, KR;

Assignee:

SK enpulse Co., Ltd., Pyeongtaek-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/76819 (2013.01); H01L 21/7684 (2013.01); H01L 21/76898 (2013.01); H01L 21/31053 (2013.01);
Abstract

A composition for semiconductor processing includes abrasive particles, and a dishing control additive, comprising a first dishing control additive and a second dishing control additive. The first dishing control additive includes a compound having a betaine group and a salicylic group or a derivative thereof, and the second dishing control additive includes an azole-based compound. The first dishing control additive includes 0.07 parts by weight or more based on 100 parts by weight of the abrasive particles, and the second dishing control additive includes 0.13 parts by weight or less based on 100 parts by weight of the abrasive particles.

Find Patent Forward Citations

Hong, Seung. (2026). Composition for semiconductor processing and manufacturing method of semiconductor device using the same (U.S. Patent No. 12522749). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12522749

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…