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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12522704 B1

PDFFull Text
Date of Patent:
Jan. 13, 2026

Filed:

Nov. 22, 2021

Polyimide film having high dimensional stability and manufacturing method therefor

Applicant:

Pi Advanced Materials Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

Dong-Young Kim, Chungcheongbuk-do, KR;

Dae-Geon Yoo, Chungcheongbuk-do, KR;

Dong-Young Won, Chungcheongbuk-do, KR;

Assignee:

PI Advanced Materials Co., Ltd., Chungcheongbuk-do, KR;

Attorney:

Brooks, Cameron & Huebsch, PLLC

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
C08J 5/18 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); C08G 73/10 (2006.01); C08J 7/044 (2020.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B32B 27/281 (2013.01); C08G 73/1042 (2013.01); C08G 73/105 (2013.01); C08G 73/1071 (2013.01); C08J 7/044 (2020.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 2307/518 (2013.01); B32B 2307/734 (2013.01); B32B 2457/08 (2013.01); C08J 2379/08 (2013.01);
Abstract

The present invention provides a polyimide film and a manufacturing method therefor, wherein the polyimide film satisfies the following equation (1) as measured for dimensional change by a thermomechanical analyzer (TMA) undergoing a temperature elevation process from 25° C. to 400° C. and then a cooling process from 400° C. to 25° C. Equation (1) dimensional measurement in TD direction (cooling, 50° C.)−dimensional measurement in TD direction (temperature elevation, 50° C.)<0 μm.

Find Patent Forward Citations

Kim, Dong-Young. (2026). Polyimide film having high dimensional stability and manufacturing method therefor (U.S. Patent No. 12522704). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12522704

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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