The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Apr. 22, 2021
Applicant:
Japan Composite Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
JAPAN COMPOSITE CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/04 (2006.01); C08J 5/10 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); C08K 3/04 (2006.01); C08K 3/40 (2006.01); C08K 7/06 (2006.01); C08K 7/14 (2006.01); C08K 7/28 (2006.01); C08K 13/04 (2006.01); C08L 67/06 (2006.01); C08L 87/00 (2006.01); B29B 11/16 (2006.01); B29C 70/00 (2006.01); B29C 70/02 (2006.01); B29K 267/00 (2006.01); B29K 307/04 (2006.01); B29K 309/08 (2006.01); B32B 27/04 (2006.01); B32B 27/20 (2006.01); B32B 27/36 (2006.01); C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08K 5/098 (2006.01); C08K 7/20 (2006.01); C08L 25/06 (2006.01); C08L 101/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08J 5/042 (2013.01); C08J 5/043 (2013.01); C08J 5/047 (2013.01); C08J 5/10 (2013.01); C08J 5/249 (2021.05); C08K 3/013 (2018.01); C08K 3/04 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08K 7/28 (2013.01); C08K 13/04 (2013.01); C08L 67/06 (2013.01); C08L 87/00 (2013.01); B29B 11/16 (2013.01); B29C 70/003 (2021.05); B29C 70/02 (2013.01); B29C 70/025 (2013.01); B29K 2267/06 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B32B 27/04 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); C08J 5/243 (2021.05); C08J 5/244 (2021.05); C08J 5/247 (2021.05); C08J 2325/06 (2013.01); C08J 2367/06 (2013.01); C08J 2423/06 (2013.01); C08J 2431/04 (2013.01); C08J 2463/10 (2013.01); C08J 2467/06 (2013.01); C08K 3/046 (2017.05); C08K 2003/222 (2013.01); C08K 2003/265 (2013.01); C08K 5/098 (2013.01); C08K 7/06 (2013.01); C08K 7/20 (2013.01); C08K 2201/004 (2013.01); C08K 2201/005 (2013.01); C08K 2201/016 (2013.01); C08L 25/06 (2013.01); C08L 101/00 (2013.01); C08L 2205/02 (2013.01); C08L 2205/035 (2013.01); Y10T 428/25 (2015.01); Y10T 428/252 (2015.01); Y10T 428/269 (2015.01);
Abstract
A thin plate molding material includes a resin composition containing a resin component and a filling material, and a reinforced fiber with a predetermined fiber length. The content ratio of the reinforced fiber is a predetermined ratio. The mixing ratio of the resin component is a predetermined ratio.
Quick Actions:
Hakotani, Masahiro. (2026). Thin plate molding material and molded article (U.S. Patent No. 12522702). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12522702
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile