The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Apr. 20, 2023
Paramylon-based resin, molding material, molded body, and method for producing paramylon-based resin
Nec Corporation, Tokyo, JP;
University of Tsukuba, Tsukuba, JP;
Midori Shimura, Tokyo, JP;
Shukichi Tanaka, Tokyo, JP;
Toshie Miyamoto, Tokyo, JP;
Masatoshi Iji, Ibaraki, JP;
NEC Corporation, Tokyo, JP;
UNIVERSITY OF TSUKUBA, Tsukuba, JP;
Abstract
A paramylon-based resin having a weight-average molecular weight of paramylon in a range of 70000 to 140000, and formed by substituting hydrogen atoms of hydroxy groups of a paramylon with a long-chain component being a linear saturated aliphatic acyl group having 14 or more carbon atoms and a short-chain component being an acyl group (acetyl group or/and propionyl group) having 2 or 3 carbon atoms, wherein a degree of substitution with the long-chain component (DS) and a degree of substitution with the short-chain component (DS) satisfy the following conditional expressions (1) and (2), Izod impact strength is 5.0 kJ/mor more, and an MFR (melt flow rate at 210° C. and under a load of 5 kg) is 2 g/10 min or more. To provide a paramylon-based resin excellent in mechanical characteristics and thermoplasticity2.2≤≤2.8 (1)5≤≤25 (2).